“India set to approve Micron’s $3b chip packaging & test unit”, Economic Times, June 17, 2023:

“India is poised to approve a $3-billion investment by US semiconductor company Micron to set up an outsourced semiconductor assembly and test (OSAT) unit with at least four assembly lines, people in the know told ET.

The Idaho-headquartered company will initially invest about $2.5 billion with more investments likely to be made over a five-year period, sources said.

This will mark the first such approval of an OSAT unit — also referred to as Assembly Testing Marking and Packaging (ATMP) unit — by the central government which has unveiled a Rs 76,000 crore package to kickstart semiconductor manufacturing….”

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